High-volume, fully assembled PC boards are available as high-density, hybrid PCB assemblies.
High-volume, fully assembled PC boards are available as high-density, hybrid PCB assemblies. Sizes as large as 18 x 24 inches for SMT or non-SMT backplanes are available. Assembly technologies include SMT, press-fit, wave solder, selective PTH solder and hand assembly and solder. Components that can be placed on-board include high I/O area array modules BGA/CGA down to 0.03-inch pitch, and PBGA, fine-pitch leaded parts to 12 mils and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Endicott Interconnect Technologies, Inc. www.eitny.com