Flip chip package

By Plant Engineering Staff April 26, 2007


The CoreEZ semiconductor package uses an organic, thin core build-up flip chip technology that combines electrical performance, wireability and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core. The core via density provides 199 micron via-to-via core pitch, resulting in a coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables the chip to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
Endicott Interconnect Technologies, Inc.
www.eitny.com