Lee Smith, 30
Lead Software Engineer, Mettler Toledo Safeline Ltd.; Manchester, England
MS Software Engineering, The University of Manchester (UMIST)

Smith is a lead software engineer for Mettler Toledo’s metal-detection business. Based in Manchester, England, he has strategic and technical ownership of the connectivity and machine-integration capabilities for all metal-detection products. In addition, he has responsibility at a divisional level to define a harmonized approach to connectivity and machine integration across all of Mettler Toledo’s product-inspection systems, such as metal detection, checkweighers, X-ray inspection, and vision inspection. Smith is one of Mettler Toledo’s Organization for Machine Automation and Control (OMAC) representatives and is also a member of the PackML Technical Advisory Board. Smith has worked for Mettler Toledo since 2010, prior to which he worked for Schneider Electric in an embedded-software engineer role specializing in electrical substation communications. He holds a master’s degree in software engineering from UMIST and is an elected Chartered Engineer on the UK Engineering Council. Smith recently presented at the OMAC PackML workshop in Chicago where he provided a case study of Mettler Toledo’s PackML implementation as well as examples of how to use PackML in combination with various industry standard protocols (e.g., OPC, EtherNet/IP) to offer customers a true end-to-end integration solution. Smith and his wife spend most of their free time with their three young sons, including having fun days out experiencing a wide range of recreational activities. They recently visited the Chill Factore indoor snow park—a new experience since the U.K. doesn’t get much snow during the year.

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