High-volume, fully assembled PC boards are available as high-density, hybrid PCB assemblies.
High-volume, fully assembled PC boards are available as high-density, hybrid PCB assemblies. Sizes as large as 18 x 24 inches for SMT or non-SMT backplanes are available. Assembly technologies include SMT, press-fit, wave solder, selective PTH solder and hand assembly and solder. Components that can be placed on-board include high I/O area array modules BGA/CGA down to 0.03-inch pitch, and PBGA, fine-pitch leaded parts to 12 mils and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Endicott Interconnect Technologies, Inc. www.eitny.com
Annual Salary Survey
After almost a decade of uncertainty, the confidence of plant floor managers is soaring. Even with a number of challenges and while implementing new technologies, there is a renewed sense of optimism among plant managers about their business and their future.
The respondents to the 2014 Plant Engineering Salary Survey come from throughout the U.S. and serve a variety of industries, but they are uniform in their optimism about manufacturing. This year’s survey found 79% consider manufacturing a secure career. That’s up from 75% in 2013 and significantly higher than the 63% figure when Plant Engineering first started asking that question a decade ago.