High-volume, fully assembled PC boards are available as high-density, hybrid PCB assemblies.
High-volume, fully assembled PC boards are available as high-density, hybrid PCB assemblies. Sizes as large as 18 x 24 inches for SMT or non-SMT backplanes are available. Assembly technologies include SMT, press-fit, wave solder, selective PTH solder and hand assembly and solder. Components that can be placed on-board include high I/O area array modules BGA/CGA down to 0.03-inch pitch, and PBGA, fine-pitch leaded parts to 12 mils and SMT discretes and chips down to 0402 size, as well as high-density, high-I/O connectors. Endicott Interconnect Technologies, Inc. www.eitny.com
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Annual Salary Survey
Before the calendar turned, 2016 already had the makings of a pivotal year for manufacturing, and for the world.
There were the big events for the year, including the United States as Partner Country at Hannover Messe in April and the 2016 International Manufacturing Technology Show in Chicago in September. There's also the matter of the U.S. presidential elections in November, which promise to shape policy in manufacturing for years to come.
But the year started with global economic turmoil, as a slowdown in Chinese manufacturing triggered a worldwide stock hiccup that sent values plummeting. The continued plunge in world oil prices has resulted in a slowdown in exploration and, by extension, the manufacture of exploration equipment.
Read more: 2015 Salary Survey