PackML Clarification and Implementation Assistance
The OMAC Packaging Workgroup (OPW) has been busy clarifying the recently ratified PackML standard and, at PackExpo Las Vegas 2009, it announced the availability of an implementation guide developed by Proctor & Gamble (P&G). OMAC technical director, Dave Bauman, also recently responded to some comments made by Dave Chappell through Control Engineering’s Make2Pack/ISA88 blog, furth...
The OMAC Packaging Workgroup (OPW) has been busy clarifying the recently ratified PackML standard and, at PackExpo Las Vegas 2009, it announced the availability of an implementation guide developed by Proctor & Gamble (P&G). OMAC technical director, Dave Bauman, also recently responded to some comments made by Dave Chappell through Control Engineering ’s Make2Pack/ISA88 blog, further clarifying PackML.
The P&G PackML Implementation Guide was created to aid software developers in achieving a clean and efficient implementation of PackML. Rob Aleksa, P&G corporate machine control section head, said, “Although the PackML standard exists, a well-defined implementation approach has not yet been developed. P&G found many industry PackML implementations not very robust and often too complex. This frequently led to reworking the software, costing effort and money.”
So, P&G developed “an efficient, robust software validated on a variety of machine systems,” said Aleksa. “We decided to provide the software to industry, through OMAC, to drive a standard implementation approach. We want to ensure P&G and others get maximum benefit from the PackML standard.”
In August 2009, Procter & Gamble provided the guide to OMAC, along with the software and help files for an implementation on the Rockwell Automation ControlLogix platform. It is available for download from the OMAC website.
OMAC’s Bauman said, “OPW is anticipating that the implementation of this guide and example software code will help accelerate the adoption of PackML by users and machine builders. In fact, a number of other technology providers including B&R Automation, GE Fanuc, Kepware, Schneider Electric Elau Packaging Solutions, Siemens, and Wonderware are planning to develop example software code that will also be available for download on the OMAC website.”
In a late October blog posting, Dave Chappell asked what could be done to help users better understand the differences between all of the PackML versions, and to accurately communicate which one is being discussed? “There are many similarities among versions,” said Chappell, “and people often used the term 'PackML’ and don’t further clarify precisely which version is being referenced, which can lead to some very interesting and unintended negative results, and can dilute the success of PackML.” He identified the following documents as examples of version similarities:
PackML Version 2.2 - March 2002;
PackML Version 3.0 - June 2006;
Tag Naming Guidelines (PackML V3.0) July 2006; and
ISA TR88.00.02 - August 2008.
P&G’s Aleksa commented on the versions, based on his company’s experience:
PackML Version 2.2 - March 2002 - (good but too many execution issues. P&G decided to minimize deployment)
PackML Version 3.0 - June 2006; (good version, deploying)
Tag Naming Guidelines (PackML v3.0) July 2006; (good, however way too many tags for our use, implemented only what we needed).
In the end, said Aleksa, “the business benefit is achieving the same operating procedure for machines with both 2.2 and 3.0. The issue was complexity of executing. It was more complex to do 2.2.”
Clarification from OMAC
OMAC’s Bauman provided the following information and clarification:
“The ISA88 technical report that incorporated PackML and PackTags into the ISA88 standard is the version that OMAC is promoting, since it is accepted as part of the ISA88 standard with the approval of this technical report: ISA-TR88.00.02. As Dave Chappell suggests, we can change the OMAC Web site to reference this number, and we will make this change. Clicking on this title will take you to the ISA Standards Web page where this technical report can be downloaded.”
Although the ISA-TR88.00.02 and PackML V3.0 and PackTags 3.0 are not identical, they are very similar, said Bauman. The changes from v3.0 to the ISA-TR888.00.02 “are all pretty minor,” he added.
However, “PackML v2.2 to PackML v3 saw some very significant changes that addressed some of the shortcomings of v2.2. Version 3 added the mode manager since v2.2 only addressed the automatic mode. In addition there were a number of states added so that the PackML state model would better match with the S88 model. Version 2.2 had 11 states and v3 and the ISA-TR88.00.02 both have 17. Likewise PackTags v2 to v3 added a number of tags to support the additional functionality going from PackML v2.2 to v3.0.”
Summarizing the differences between PackML v2.2, PackML v3, and the ISA-TR88.00.02 Bauman said: ISA-TR88.00.02 is the version of PackML and PackTags that people should be using, and that is what OMAC is promoting. Minor changes exist between PackML v3/PackTags v3 and the technical report. Major changes exist between PackML v2.2/PackTags v2 and PackML v3/PackTags v3.
Level sensors for critical, sanitary packaging lines
The Micropulse SF fill level sensor from Balluff uses magnetostrictive technology to provide precise fill level measurements without product contact, providing continuous measurement in applications that require adherence to the strictest standards of sanitation and cleanliness. The sensor’s continuously variable analog output signal reportedly allows for easy connection to control systems. The sensors are made from stainless steel and meet international hygiene standards and food industry requirements, including 3-A and EHEDG (European Hygienic Engineering Design Group) sanitary standards.
Features include ability to compensate for surface foam to deliver reliable, accurate fill level values; installation without adjustment; auitable for clean in place (CIP) and sterilize in place (SIP) to 130 °C; and international certifications ensure global acceptance.
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2012 Salary Survey
In a year when manufacturing continued to lead the economic rebound, it makes sense that plant manager bonuses rebounded. Plant Engineering’s annual Salary Survey shows both wages and bonuses rose in 2012 after a retreat the year before.
Average salary across all job titles for plant floor management rose 3.5% to $95,446, and bonus compensation jumped to $15,162, a 4.2% increase from the 2010 level and double the 2011 total, which showed a sharp drop in bonus.