OMAC working group to meet at Pack Expo
Packing line integration to be covered at demo
The OMAC Packaging Workgroup (OPW) will host a demonstration of its guidelines at Pack Expo 2007, October 15-17 at the Las Vegas Convention Center. The OPW Booth, number C-953 in the Association Pavilion, will highlight the "Benefits of Packaging Line Integration."
Nine companies will be participating with demonstrations of controller, HMI, and MES functionality using the OPW Connect-and-Pack Guidelines:
Acumence, B&R, Beckhoff, Elau, GE Fanuc, Iconics, Kepware, Siemens, and Wago. All of the demonstration units will be integrated together using OPC over Ethernet.
Seven of the companies (B&R, Beckhoff, Elau, GE Fanuc, Kepware, Siemens and Wago) will be implementing the OPW PackML State Model on their controllers. B&R, GE Fanuc, Iconics and Siemens will be implementing the PackML State Model on their respective HMI's. PackTags will allow any HMI application to be able to display and control the state model of any of the controllers.
Three companies (Acumence, Iconics and Siemens) will be implementing MES functionality using PackML. These MES applications will be able to connect to any of the controllers through PackTags, calculate OEE, and pareto chart the times in the states of the PackML state model.
The OMAC Packaging Workgroup will also host a User Meeting on Tuesday, October 16, at 2:00 p.m. in Room S-232 in the South Hall of the Las Vegas Convention Center.
The purpose of the meeting is to present an overview of the OPW Connect-and-PackTM Guidelines and their benefits to users, OEM's, and technology providers. During the meeting, Rick VanDyke, Group Manager Controls & MES Systems at Frito Lay, will discuss how OPW Guidelines support "Transforming Manufacturing Packaging System Performance."
On Wednesday, October 17, the PackML Group of the OMAC Packaging Workgroup will host a meeting at 2:00 pm. in Room S-225 in the South Hall of the Las Vegas Convention Center. The purpose of the meeting is to update attendees on the progress of incorporating PackML into the
ISA88 Part 5 (Make2Pack) standard.
For additional information on the OMAC Packaging Workgroup's demonstration at Pack Expo, visit
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Before the calendar turned, 2016 already had the makings of a pivotal year for manufacturing, and for the world.
There were the big events for the year, including the United States as Partner Country at Hannover Messe in April and the 2016 International Manufacturing Technology Show in Chicago in September. There's also the matter of the U.S. presidential elections in November, which promise to shape policy in manufacturing for years to come.
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Read more: 2015 Salary Survey