Linear inductive position sensor for clamping technology
Balluff's BIP linear inductive position sensor is non-contact and has linear travel of 40mm and resolution of 14 microns.
Balluff’s BIP linear inductive position sensor has a measuring principle for position monitoring in applications such as drive spindles and clamping devices for tools and workpieces. The sensor can also be used for other linear motion applications such as punch depth, grab positions, rolling positions, valve positions, etc.
The BIP is non-contact. Linear travel of up to 40 mm can be detected. The Balluff BIP has resolution of 14 microns, repeat accuracy of +/- 80 microns and non linearity of +/- 250 microns for optimal process quality. Available outputs include 0-10 V and 4-20 mA. The sensor’s repeat accuracy allows for process quality, even in cramped locations with temperatures up to 85 C.
Mechanical adjustments are not necessary, allowing the measuring range to be adapted to the application. With the IO-Link Variant this is also possible via the control system.
- Edited by Chris Vavra, Control Engineering, www.controleng.com
- Events & Awards
- Magazine Archives
- Oil & Gas Engineering
- Salary Survey
- Digital Reports
- Survey Prize Winners
Annual Salary Survey
Before the calendar turned, 2016 already had the makings of a pivotal year for manufacturing, and for the world.
There were the big events for the year, including the United States as Partner Country at Hannover Messe in April and the 2016 International Manufacturing Technology Show in Chicago in September. There's also the matter of the U.S. presidential elections in November, which promise to shape policy in manufacturing for years to come.
But the year started with global economic turmoil, as a slowdown in Chinese manufacturing triggered a worldwide stock hiccup that sent values plummeting. The continued plunge in world oil prices has resulted in a slowdown in exploration and, by extension, the manufacture of exploration equipment.
Read more: 2015 Salary Survey