SEARCH Archives
Loading
Sponsored by:

IO module replacement advice: Check shielding, ground loops, electromagnetic noise

I/O wiring can be among the most challenging (and perhaps feared) of upgrades. When replacing input/output connections, what are key considerations? John Lehman, Dataforth Corp. engineering manager, offered answers to some key questions.

John Lehman, Mark T. Hoske

10/19/2011


Twisted wire pairs reduce magnetically induced errors. Courtesy: DataforthControl Engineering: When replacing input/output connections, what are key considerations?

John Lehman, Dataforth Corp. engineering manager: When replacing input/output connections, key considerations are grounding, shielding, use of twisted pair cables, cable spacing, bundling of signal and power conductors, appropriate wire gauge, insulation rating, proper wire routing techniques, hazardous location concerns, and wiring practices for system electromagnetic compliance.

Q: Is there documentation?

Lehman: Good installations and system designs will have thorough documentation on I/O connection and wiring requirements. Dataforth offers extensive information on I/O wiring to preserve signal integrity in a signal conditioning tutorial. https://www.dataforth.com/catalog/pdf/DTF-Tutorial.pdf 

Q: What functionality do attached applications need to incorporate?

Lehman: The functionality that attached applications need to incorporate depends on system requirements. Using isolated signal conditioning products relaxes the many requirements of I/O wiring and solves many system wiring problems.

Q: What types of signals (analog, digital, serial, mixed...), what units (current, volts, resistance, ac, dc...), what range, and how many channels are needed?

Lehman: These are all important considerations for I/O wiring and are dictated by system requirements. Analog signals, digital signals, and power signals should be routed in separate bundles, or at least in separate twisted, shielded pair cables to preserve signal integrity. Channel input-to-output isolation, input-to-power isolation, and channel-to-channel isolation are also critical specifications of a good system design.

Q: What network protocols are required, and will they be wired, wireless, serial, digital, or a combination?

Lehman: The most common networking method remains TCP/IP. Modbus is still a prevalent and useful protocol. Wireless is making inroads into many industrial applications. Q: What are the sensing, signal conditioning, distributed control, isolation, and other requirements? Lehman: Modern sensors allow users to monitor more process variables than ever, which improves process efficiency and reliability and provides for better health-of-machine statistics, as well as prevention of downtime and accidents. Signal conditioning is an essential part of any system design as it provides proper scaling, filtering, linearization, and isolation. Microcontrollers, miniaturization of electronics, and wired and wireless networks allow more distributed control than ever. This expanded control, along with new opportunities in remote process monitoring, also supports more efficient, reliable, safe, and cost-effective systems.

Q: Will the application expand, and by how much?

Lehman: Good I/O wiring practices allow for easier future expansion.

Q: What design and how granular should the modules be?

Lehman: I/O wiring is an essential part of any successful system design and must be considered from the start of a project. Large systems, once wired, can be prohibitive to reconfigure.

Q: Will the I/O connections be enclosed or exposed?

Lehman: System requirements will specify whether I/O connections are enclosed or exposed. This is largely an environmental concern, but it is also important for operator safety and for applications in hazardous locations where arcing and sparking are not allowed.

Q: What are among the most-overlooked considerations?

Lehman: The most overlooked considerations are grounding, shielding, ground loops, capacitively and inductively coupled noise, and wiring practices for electromagnetic compliance (CE, FCC).

- Mark T. Hoske, CFE Media, Control Engineering, www.controleng.com, and John Lehman, engineering manager at Dataforth Corporation. www.dataforth.com



No comments
The Top Plant program honors outstanding manufacturing facilities in North America. The 2012 Top Plant winners have been named.
In 2012, Plant Engineering's Product of the Year program will celebrated its 25th anniversary. Read about the 2012 winners and nominate for 2013.
The Leaders Under 40 program features outstanding young people who are making a difference in manufacturing. View the 2012 Leaders here.
Investment in excellence: One plant's improved productivity and quality was repaid when their company expanded the facility
Strategic uptime, Increased capacity goes right to the bottom line
2013 Forecast Issue: A shift in manufacturing
Case Study Database

Case Study Database

Get more exposure for your case study by uploading it to the Plant Engineering case study database, where end-users can identify relevant solutions and explore what the experts are doing to effectively implement a variety of technology and productivity related projects.

These case studies provide examples of how knowledgeable solution providers have used technology, processes and people to create effective and successful implementations in real-world situations. Case studies can be completed by filling out a simple online form where you can outline the project title, abstract, and full story in 1500 words or less; upload photos, videos and a logo.

Click here to visit the Case Study Database and upload your case study.

Alarm management tips, Power management, Building automation
Estimating data center PUE, Design tips for cost savings, Networked controls, NFPA 70E
Attacking Energy Costs: Strategies for showing financial return on energy management investments

2012 Salary Survey

In a year when manufacturing continued to lead the economic rebound, it makes sense that plant manager bonuses rebounded. Plant Engineering’s annual Salary Survey shows both wages and bonuses rose in 2012 after a retreat the year before.

Average salary across all job titles for plant floor management rose 3.5% to $95,446, and bonus compensation jumped to $15,162, a 4.2% increase from the 2010 level and double the 2011 total, which showed a sharp drop in bonus.

2012 Salary Survey Analysis

2012 Salary Survey Results


Poll of the Week

What category most helps you select new products?
Recommendation from colleagues
Product of the Year winners
Supplier information
Trade show visit


Click Here for Poll Archives
Sponsored by:

About Us | Contact Us | Advertise | Subscribe to Magazine | Site Map | Privacy Policy
Home | Channels | New Products | Media Library | Connect | Industry News | Events and Awards | Newsletters | Blogs | Magazine
Control Engineering | Plant Engineering | Consulting-Specifying Engineer
All content copyright © 2010-2013 CFE Media. All rights reserved.