GE Intelligent Platforms: TranSphere TS Wireless I/O
TranSphere TS Wireless I/O from GE Intelligent Platforms is an integrated, scalable family of wireless communication products for analog and discrete I/O signals.
GE Intelligent Platforms' TranSphere TS Wireless I/O family of wireless communication products for analog and discrete I/O signals allows users to interface I/O signals with standard serial and IP/Ethernet protocols or regenerate I/O signals among PLCs, RTUs and control/monitoring devices. Standard serial or IP/Ethernet payload communications for separate devices is also supported. GE Intelligent Platforms calls the TranSphere TS Wireless I/O a "simple cost effective, out-of-the-box communications solution." The TranSphere TS Wireless I/O Base module integrates on-board I/O with a 900 MHz or a 2.4 GHz radio. Optional TranSphere TS Wireless I/O Expansion modules attach to the Base module to accommodate a user's specific I/O count. The company also embeds additional wireless connectivity called WeXP using the IEEE 802.15.4 standard. WeXP allows Expansion modules to be located up to 2,500 ft from the Base module. The base and expansion modules are scalable to a user's I/O count, distance, and location requirements.
The TranSphere TS Wireless I/O Base Module supports three general function types:
- I/O signal extension - TranSphere TS Wireless I/O reads, transmits and regenerates I/O signals between multiple devices.
- I/O protocol addressability - TranSphere TS Wireless I/O operates as a protocol node upporting the direct addressability of connected I/O from a growing library of protocols such as Modbus, Modbus TCP, DNP.3 or DF1.
- Serial and IP/Ethernet payload communication - TranSphere Wireless I/O also supports payload communication for an attached RTU, PLC or other peripheral device. Transparent serial or IP/Ethernet payload communication operates simultaneously with I/O signal extension or I/O protocol addressability.
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- Edited by Mark T. Hoske, editor in chief, Control Engineering , www.controleng.com.
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