Flip chip package
The CoreEZ semiconductor package uses an organic, thin core build-up flip chip technology that combines electrical performance, wireability and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core. The core via density provides 199 micron via-to-via core pitch, resulting in a coreless structure. High core via density is achieved using smaller pads and 50 micron laser-drilled holes to unblock wiring channels through the core. This enables the chip to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.
Endicott Interconnect Technologies, Inc.
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Annual Salary Survey
Before the calendar turned, 2016 already had the makings of a pivotal year for manufacturing, and for the world.
There were the big events for the year, including the United States as Partner Country at Hannover Messe in April and the 2016 International Manufacturing Technology Show in Chicago in September. There's also the matter of the U.S. presidential elections in November, which promise to shape policy in manufacturing for years to come.
But the year started with global economic turmoil, as a slowdown in Chinese manufacturing triggered a worldwide stock hiccup that sent values plummeting. The continued plunge in world oil prices has resulted in a slowdown in exploration and, by extension, the manufacture of exploration equipment.
Read more: 2015 Salary Survey